News & Reports

ECWC15 - Result Announcement of Best Paper Award

29 Nov 2020

Started from Dec 2019, ECWC15 launched the “Call For Paper” campaign, which have drawn enthusiastic response from the PCB and electronics manufacturing industry around the world to submit papers. Committee nominated the best abstracts out of all submissions and their full papers were reviewed and judged based on the below criteria: Originality (weighting 40%) , Innovation (weighting 30%) and Quality of Argument (weighting 30%).

We are glad to announce the result of Best Paper Award: 





Paper Title

Presentation Session no.

Gold Award

(Prize: HKD30,000)

Satomi Fukushima


Development of Novel Low-temperature Curable Positive-tone Photosensitive Polybenzoxazole with High Reliability

Day 2 - S47

Silver Award (Prize: HKD20,000)

Peng Sun

Sun Yat-sen University

Stretchable Ni@NiCoP Textile for Wearable Energy Storage Clothes

Day 2 -  S39

Bronze Award (Prize: HKD10,000)

Thomas Thomas

Atotech Deutschland GmbH

Advanced Adhesion Enhancement System for High Frequency PCB Manufacturing

Day 1 -  S22

Merit Award

(Prize: HKD3,000)

Peng Sun

Sun Yat-sen University

In-plane Printed Micro-Supercapacitor with Integral PhotocatalyticFuel Cell for Self-Charging

Day 2 - S41


Shin-ichiro NAKAJIMA

Japan Aviation Electronics Ind. , Ltd.

A Novel Super Water Repellency for Glass and Metal Surfaces Based on a Dissipative Structure Control

Day 1 - S05


Kai Zhu

Shennan Circuits Co. Ltd

The Convection-dependent Competitive Adsorption of Copper Electroplating Additives in Open Circuit for PCB Via Filling

Day 2 – S27


Terry Ho

University of Electronic Science And Technology of China

A Novel Method for Accurate PCB Impedance Simulation of Any Specific Stack-ups

Day 1 - S02


Gangjun Zhao

Shengyi Electronics Co

Research and Improvement on the Lamination Void Of HDI Boards

Poster P09


Xiaojing Ye


Temperature Effects on Signal Integrity of PCB Transmission Line

Day 2 - 37


Misato Takemura


Development of Organic Composite Materials for 5G Application

Day 1 - S06


Minsu Lee

Korea Electronics Packaging and Circuits Association

The Current Status of Korea’s PCB industry

Day 2 S43


Haolin Li

Chongqing Founder Hi-Tech Electronic Inc

Tin/Silane Modified Copper Enhances Interlayer Bonding Strength for Signal Loss Reduction in High-frequency PCB Lamination

Day 2 - S36


Yuanming Chen

University of Electronic Science and Technology of China


Day 2 - S38



Congratulations! Don’t miss the chance to register our conference and  view the presentation of awarded papers, you may refer to their presentation session. The Award Ceremony will be held at the closing event of ECWC15 at Shenzhen on 2 Dec 2020. Welcome to join and share the joy with awarded author.