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ECWC 15 – 最佳论文公布

29 Nov 2020
由上年12月开始,「第十五届世界电子电路大会」展开征集论文活动,吸引世界各国学术、行业专家、学者、技术人员参与递交论文。 ECWC15评审委员会从所有递交的论文摘要中提名最佳摘要,并评审最终论文全文。最佳论文评审准则分三方面,包括原创性(40%)、创新观点(30%)和论文论据(30%)。
 
在经过评审的专业意见后,选出以下的得奖最佳论文︰

 

Award

Author

Company

Paper Title

Presentation Session no.

Gold Award

(Prize: HKD30,000)

Satomi Fukushima

TAIYO HOLDINGS CO. LTD.,

Development of Novel Low-temperature Curable Positive-tone Photosensitive Polybenzoxazole with High Reliability

Day 2 - S47

Silver Award (Prize: HKD20,000)

Peng Sun

Sun Yat-sen University

Stretchable Ni@NiCoP Textile for Wearable Energy Storage Clothes

Day 2 -  S39

Bronze Award (Prize: HKD10,000)

Thomas Thomas

Atotech Deutschland GmbH

Advanced Adhesion Enhancement System for High Frequency PCB Manufacturing

Day 1 -  S22

Merit Award

(Prize: HKD3,000)

Peng Sun

Sun Yat-sen University

In-plane Printed Micro-Supercapacitor with Integral PhotocatalyticFuel Cell for Self-Charging

Day 2 - S41

 

Shin-ichiro NAKAJIMA

Japan Aviation Electronics Ind. , Ltd.

A Novel Super Water Repellency for Glass and Metal Surfaces Based on a Dissipative Structure Control

Day 1 - S05

 

Kai Zhu

Shennan Circuits Co. Ltd

The Convection-dependent Competitive Adsorption of Copper Electroplating Additives in Open Circuit for PCB Via Filling

Day 2 – S27

 

Terry Ho

University of Electronic Science And Technology of China

A Novel Method for Accurate PCB Impedance Simulation of Any Specific Stack-ups

Day 1 - S02

 

Gangjun Zhao

Shengyi Electronics Co

Research and Improvement on the Lamination Void Of HDI Boards

Poster P09

 

Xiaojing Ye

SCC

Temperature Effects on Signal Integrity of PCB Transmission Line

Day 2 - 37

 

Misato Takemura

TAIYO INK MFG.CO.,LTD.

Development of Organic Composite Materials for 5G Application

Day 1 - S06

 

Minsu Lee

Korea Electronics Packaging and Circuits Association

The Current Status of Korea’s PCB industry

Day 2 S43

 

Haolin Li

Chongqing Founder Hi-Tech Electronic Inc

Tin/Silane Modified Copper Enhances Interlayer Bonding Strength for Signal Loss Reduction in High-frequency PCB Lamination

Day 2 - S36

 

Yuanming Chen

University of Electronic Science and Technology of China

 

Day 2 - S38

 

恭喜所有得奖者! 如果不想错过机会,立即登记报名参与会议,欣赏最佳论文的汇报内容。最佳论文颁奖典礼则拟定于2020年12月2日的电子电路大会现场举行。